Three steps to determine the right specification of sapphire wafers
Step 1. Determine the Size
Standard sapphire wafers are available in diameters of 1 inch, 2 inches, 3 inches, 4 inches, 6 inches, 8 inches, and 12 inches.
For sapphire carriers used in bonding processes, common diameters are 104mm, 156mm, and 159mm.
Each diameter of sapphire wafer has a corresponding standard thickness, and the thickness can be customized according to your specific requirements.
If you need special sizes, we can also customize them for you.
Step 2. Determine the Surface Polish type
Sapphire substrates are available in single-side polished (SSP) and double-side polished (DSP) types. In most material growth processes, single-side polished sapphire substrates are commonly used.
Step 3. Determine the Crystal Orientation
The C-plane sapphire wafer is the most commonly used crystal plane.
The A-plane, R-plane, and M-plane sapphire wafers are also common choices in laboratories.
If you are engaged in the growth of two-dimensional materials, graphene, or diamond, you may need a misorientated sapphire wafer (off-cut wafer). We offer the following five commonly used misorientated sapphire wafers with different off-cut angles for your selection:
C-A direction: 0.5°, 1°, 1.5°, 2°, 4°, 6°, 8°, 10°
C-M direction: 0.5°, 1°, 2°, 4°, 6°
R-M direction: 1°, 2°, 5°, 8°
A-M direction: 7°
A-C direction: 1°, 4°, 5°
